Standard

Conformal growth of GaP on high aspect ratio Si structured surface via plasma-enhanced atomic layer deposition. / Uvarov, Alexander; Gudovskikh, Alexander; Baranov, Artem; Maksimova, Alina; Vyacheslavova, Ekaterina; Kirilenko, Demid.

в: Surface and Coatings Technology, Том 477, 130357, 15.02.2024.

Результаты исследований: Научные публикации в периодических изданияхстатьяРецензирование

Harvard

Uvarov, A, Gudovskikh, A, Baranov, A, Maksimova, A, Vyacheslavova, E & Kirilenko, D 2024, 'Conformal growth of GaP on high aspect ratio Si structured surface via plasma-enhanced atomic layer deposition', Surface and Coatings Technology, Том. 477, 130357. https://doi.org/10.1016/j.surfcoat.2023.130357

APA

Uvarov, A., Gudovskikh, A., Baranov, A., Maksimova, A., Vyacheslavova, E., & Kirilenko, D. (2024). Conformal growth of GaP on high aspect ratio Si structured surface via plasma-enhanced atomic layer deposition. Surface and Coatings Technology, 477, [130357]. https://doi.org/10.1016/j.surfcoat.2023.130357

Vancouver

Uvarov A, Gudovskikh A, Baranov A, Maksimova A, Vyacheslavova E, Kirilenko D. Conformal growth of GaP on high aspect ratio Si structured surface via plasma-enhanced atomic layer deposition. Surface and Coatings Technology. 2024 Февр. 15;477. 130357. https://doi.org/10.1016/j.surfcoat.2023.130357

Author

Uvarov, Alexander ; Gudovskikh, Alexander ; Baranov, Artem ; Maksimova, Alina ; Vyacheslavova, Ekaterina ; Kirilenko, Demid. / Conformal growth of GaP on high aspect ratio Si structured surface via plasma-enhanced atomic layer deposition. в: Surface and Coatings Technology. 2024 ; Том 477.

BibTeX

@article{b2af5c609ae94897bf024ce96d023215,
title = "Conformal growth of GaP on high aspect ratio Si structured surface via plasma-enhanced atomic layer deposition",
abstract = "This article is concerned with the study of conformal growth of thin gallium phosphide (GaP) layers by plasma-enhanced atomic layer deposition (PE-ALD) on a Si structured surface. GaP layers were deposited on (100) silicon wafers with a structured surface in the form of silicon microcolumns and black silicon. Deposition process were carried out at temperature of 380 °C using trimethylgallium and phosphine precursors. According to transmission electron microscopy (TEM), GaP layers deposited by this method conformally grown on the high aspect ratio structured silicon surface. The energy-dispersive X-ray spectroscopy (EDX) study show that the distribution of the main components of the GaP layer is uniform alongside surface of the silicon microcolumns and wires. High resolution TEM study confirms that GaP layers on the surface of silicon microcolumns and wires are epitaxial with the inclusion of twin lattice defects. Therefore, this deposition method can be used for the conformal deposition of thin crystalline layers of GaP on structured silicon surfaces with a high aspect ratio.",
keywords = "Conformal deposition, Gallium phosphide, PEALD, Silicon nanowires, TEM",
author = "Alexander Uvarov and Alexander Gudovskikh and Artem Baranov and Alina Maksimova and Ekaterina Vyacheslavova and Demid Kirilenko",
year = "2024",
month = feb,
day = "15",
doi = "10.1016/j.surfcoat.2023.130357",
language = "English",
volume = "477",
journal = "Surface and Coatings Technology",
issn = "0257-8972",
publisher = "Elsevier",

}

RIS

TY - JOUR

T1 - Conformal growth of GaP on high aspect ratio Si structured surface via plasma-enhanced atomic layer deposition

AU - Uvarov, Alexander

AU - Gudovskikh, Alexander

AU - Baranov, Artem

AU - Maksimova, Alina

AU - Vyacheslavova, Ekaterina

AU - Kirilenko, Demid

PY - 2024/2/15

Y1 - 2024/2/15

N2 - This article is concerned with the study of conformal growth of thin gallium phosphide (GaP) layers by plasma-enhanced atomic layer deposition (PE-ALD) on a Si structured surface. GaP layers were deposited on (100) silicon wafers with a structured surface in the form of silicon microcolumns and black silicon. Deposition process were carried out at temperature of 380 °C using trimethylgallium and phosphine precursors. According to transmission electron microscopy (TEM), GaP layers deposited by this method conformally grown on the high aspect ratio structured silicon surface. The energy-dispersive X-ray spectroscopy (EDX) study show that the distribution of the main components of the GaP layer is uniform alongside surface of the silicon microcolumns and wires. High resolution TEM study confirms that GaP layers on the surface of silicon microcolumns and wires are epitaxial with the inclusion of twin lattice defects. Therefore, this deposition method can be used for the conformal deposition of thin crystalline layers of GaP on structured silicon surfaces with a high aspect ratio.

AB - This article is concerned with the study of conformal growth of thin gallium phosphide (GaP) layers by plasma-enhanced atomic layer deposition (PE-ALD) on a Si structured surface. GaP layers were deposited on (100) silicon wafers with a structured surface in the form of silicon microcolumns and black silicon. Deposition process were carried out at temperature of 380 °C using trimethylgallium and phosphine precursors. According to transmission electron microscopy (TEM), GaP layers deposited by this method conformally grown on the high aspect ratio structured silicon surface. The energy-dispersive X-ray spectroscopy (EDX) study show that the distribution of the main components of the GaP layer is uniform alongside surface of the silicon microcolumns and wires. High resolution TEM study confirms that GaP layers on the surface of silicon microcolumns and wires are epitaxial with the inclusion of twin lattice defects. Therefore, this deposition method can be used for the conformal deposition of thin crystalline layers of GaP on structured silicon surfaces with a high aspect ratio.

KW - Conformal deposition

KW - Gallium phosphide

KW - PEALD

KW - Silicon nanowires

KW - TEM

UR - https://www.mendeley.com/catalogue/962edcb7-53c1-3201-8bc5-81434608e0f7/

U2 - 10.1016/j.surfcoat.2023.130357

DO - 10.1016/j.surfcoat.2023.130357

M3 - Article

VL - 477

JO - Surface and Coatings Technology

JF - Surface and Coatings Technology

SN - 0257-8972

M1 - 130357

ER -

ID: 124350031