Standard

High rate laser deposition of conductive copper microstructures from deep eutectic solvents. / Shishov, Andrey; Gordeychuk, Dmitry; Logunov, Lev; Tumkin, Ilya.

In: Chemical Communications, Vol. 55, No. 65, 21.08.2019, p. 9626-9628.

Research output: Contribution to journal › Article › peer-review

Harvard

Shishov, A, Gordeychuk, D, Logunov, L & Tumkin, I 2019, 'High rate laser deposition of conductive copper microstructures from deep eutectic solvents', Chemical Communications, vol. 55, no. 65, pp. 9626-9628. https://doi.org/10.1039/c9cc05184h

APA

Shishov, A., Gordeychuk, D., Logunov, L., & Tumkin, I. (2019). High rate laser deposition of conductive copper microstructures from deep eutectic solvents. Chemical Communications, 55(65), 9626-9628. https://doi.org/10.1039/c9cc05184h

Vancouver

Shishov A, Gordeychuk D, Logunov L, Tumkin I. High rate laser deposition of conductive copper microstructures from deep eutectic solvents. Chemical Communications. 2019 Aug 21;55(65):9626-9628. https://doi.org/10.1039/c9cc05184h

Author

Shishov, Andrey ; Gordeychuk, Dmitry ; Logunov, Lev ; Tumkin, Ilya. / High rate laser deposition of conductive copper microstructures from deep eutectic solvents. In: Chemical Communications. 2019 ; Vol. 55, No. 65. pp. 9626-9628.

BibTeX

@article{00818543d3fa4e1d9146a58b1fe451a3,
title = "High rate laser deposition of conductive copper microstructures from deep eutectic solvents",
abstract = "In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.",
keywords = "CHOLINE CHLORIDE",
author = "Andrey Shishov and Dmitry Gordeychuk and Lev Logunov and Ilya Tumkin",
year = "2019",
month = aug,
day = "21",
doi = "10.1039/c9cc05184h",
language = "English",
volume = "55",
pages = "9626--9628",
journal = "Chemical Communications",
issn = "1359-7345",
publisher = "Royal Society of Chemistry",
number = "65",

}

RIS

TY - JOUR

T1 - High rate laser deposition of conductive copper microstructures from deep eutectic solvents

AU - Shishov, Andrey

AU - Gordeychuk, Dmitry

AU - Logunov, Lev

AU - Tumkin, Ilya

PY - 2019/8/21

Y1 - 2019/8/21

N2 - In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.

AB - In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.

KW - CHOLINE CHLORIDE

UR - http://www.scopus.com/inward/record.url?scp=85070461202&partnerID=8YFLogxK

U2 - 10.1039/c9cc05184h

DO - 10.1039/c9cc05184h

M3 - Article

C2 - 31347628

AN - SCOPUS:85070461202

VL - 55

SP - 9626

EP - 9628

JO - Chemical Communications

JF - Chemical Communications

SN - 1359-7345

IS - 65

ER -

ID: 45773165