In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.

Original languageEnglish
Pages (from-to)9626-9628
Number of pages3
JournalChemical Communications
Issue number65
StatePublished - 21 Aug 2019

    Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Metals and Alloys
  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Chemistry(all)
  • Catalysis

    Research areas


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