Standard

Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents. / Avilova, Ekaterina A.; Khairullina, Evgeniia M.; Levshakova, Aleksandra S.; Eltysheva, Elizaveta A.; Zaikina, Margarita A.; Logunov, Lev S.; Ostendorf, Andreas; Sinev, Dmitry A.; Tumkin, Ilya I.

In: ACS Applied Electronic Materials, Vol. 6, No. 6, 25.06.2024, p. 4239-4246.

Research output: Contribution to journal › Article › peer-review

Harvard

Avilova, EA, Khairullina, EM, Levshakova, AS, Eltysheva, EA, Zaikina, MA, Logunov, LS, Ostendorf, A, Sinev, DA & Tumkin, II 2024, 'Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents', ACS Applied Electronic Materials, vol. 6, no. 6, pp. 4239-4246. https://doi.org/10.1021/acsaelm.4c00337

APA

Avilova, E. A., Khairullina, E. M., Levshakova, A. S., Eltysheva, E. A., Zaikina, M. A., Logunov, L. S., Ostendorf, A., Sinev, D. A., & Tumkin, I. I. (2024). Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents. ACS Applied Electronic Materials, 6(6), 4239-4246. https://doi.org/10.1021/acsaelm.4c00337

Vancouver

Avilova EA, Khairullina EM, Levshakova AS, Eltysheva EA, Zaikina MA, Logunov LS et al. Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents. ACS Applied Electronic Materials. 2024 Jun 25;6(6):4239-4246. https://doi.org/10.1021/acsaelm.4c00337

Author

Avilova, Ekaterina A. ; Khairullina, Evgeniia M. ; Levshakova, Aleksandra S. ; Eltysheva, Elizaveta A. ; Zaikina, Margarita A. ; Logunov, Lev S. ; Ostendorf, Andreas ; Sinev, Dmitry A. ; Tumkin, Ilya I. / Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents. In: ACS Applied Electronic Materials. 2024 ; Vol. 6, No. 6. pp. 4239-4246.

BibTeX

@article{5f402801823641659e37b2a127bc6360,
title = "Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents",
abstract = "In this study, we explore the feasibility of a promising approach to fabricate conductive copper patterns with arbitrary topology on various dielectric substrates using direct laser metallization from deep eutectic solvents. We demonstrate the capability to print on industrially relevant dielectric materials, including polyimide, fiberglass plastic, and polytetrafluoroethylene (PTFE) substrates. We investigate the geometric and electrical characteristics of the resulting patterns and their composition. Our findings highlight the significant influence of the substrate material on both the formation rate of structures and their final properties. The characteristic resistance of the fabricated copper patterns is in the range from 0.23 to 1.64 Ω × mm2/m. The rate of pattern formation varied from 0.5 to 3.5 mm/s, depending on the substrate used.",
keywords = "copper, deep eutectic solvents, direct laser metallization, direct laser writing, laser-induced metal deposition, printed circuit boards",
author = "Avilova, {Ekaterina A.} and Khairullina, {Evgeniia M.} and Levshakova, {Aleksandra S.} and Eltysheva, {Elizaveta A.} and Zaikina, {Margarita A.} and Logunov, {Lev S.} and Andreas Ostendorf and Sinev, {Dmitry A.} and Tumkin, {Ilya I.}",
year = "2024",
month = jun,
day = "25",
doi = "10.1021/acsaelm.4c00337",
language = "English",
volume = "6",
pages = "4239--4246",
journal = "ACS Applied Electronic Materials",
issn = "2637-6113",
publisher = "American Chemical Society",
number = "6",

}

RIS

TY - JOUR

T1 - Commercial-Grade Dielectrics Surface Metallization by Direct Laser Deposition from Deep Eutectic Solvents

AU - Avilova, Ekaterina A.

AU - Khairullina, Evgeniia M.

AU - Levshakova, Aleksandra S.

AU - Eltysheva, Elizaveta A.

AU - Zaikina, Margarita A.

AU - Logunov, Lev S.

AU - Ostendorf, Andreas

AU - Sinev, Dmitry A.

AU - Tumkin, Ilya I.

PY - 2024/6/25

Y1 - 2024/6/25

N2 - In this study, we explore the feasibility of a promising approach to fabricate conductive copper patterns with arbitrary topology on various dielectric substrates using direct laser metallization from deep eutectic solvents. We demonstrate the capability to print on industrially relevant dielectric materials, including polyimide, fiberglass plastic, and polytetrafluoroethylene (PTFE) substrates. We investigate the geometric and electrical characteristics of the resulting patterns and their composition. Our findings highlight the significant influence of the substrate material on both the formation rate of structures and their final properties. The characteristic resistance of the fabricated copper patterns is in the range from 0.23 to 1.64 Ω × mm2/m. The rate of pattern formation varied from 0.5 to 3.5 mm/s, depending on the substrate used.

AB - In this study, we explore the feasibility of a promising approach to fabricate conductive copper patterns with arbitrary topology on various dielectric substrates using direct laser metallization from deep eutectic solvents. We demonstrate the capability to print on industrially relevant dielectric materials, including polyimide, fiberglass plastic, and polytetrafluoroethylene (PTFE) substrates. We investigate the geometric and electrical characteristics of the resulting patterns and their composition. Our findings highlight the significant influence of the substrate material on both the formation rate of structures and their final properties. The characteristic resistance of the fabricated copper patterns is in the range from 0.23 to 1.64 Ω × mm2/m. The rate of pattern formation varied from 0.5 to 3.5 mm/s, depending on the substrate used.

KW - copper

KW - deep eutectic solvents

KW - direct laser metallization

KW - direct laser writing

KW - laser-induced metal deposition

KW - printed circuit boards

UR - https://www.mendeley.com/catalogue/4b614178-adbd-345f-94a2-213c56ad582a/

U2 - 10.1021/acsaelm.4c00337

DO - 10.1021/acsaelm.4c00337

M3 - Article

VL - 6

SP - 4239

EP - 4246

JO - ACS Applied Electronic Materials

JF - ACS Applied Electronic Materials

SN - 2637-6113

IS - 6

ER -

ID: 122949732