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Laser-assisted metal deposition from CuSO4-based electrolyte solution. / Manshina, A.; Povolotskiy, A.; Ivanova, T.; Kurochkin, A.; Tver'yanovich, Yu; Kim, D.; Kim, M.; Kwon, S. C.

в: Laser Physics Letters, Том 4, № 2, 02.2007, стр. 163-167.

Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование

Harvard

Manshina, A, Povolotskiy, A, Ivanova, T, Kurochkin, A, Tver'yanovich, Y, Kim, D, Kim, M & Kwon, SC 2007, 'Laser-assisted metal deposition from CuSO4-based electrolyte solution', Laser Physics Letters, Том. 4, № 2, стр. 163-167. https://doi.org/10.1002/lapl.200610090, https://doi.org/10.1002/lapl.200610090

APA

Manshina, A., Povolotskiy, A., Ivanova, T., Kurochkin, A., Tver'yanovich, Y., Kim, D., Kim, M., & Kwon, S. C. (2007). Laser-assisted metal deposition from CuSO4-based electrolyte solution. Laser Physics Letters, 4(2), 163-167. https://doi.org/10.1002/lapl.200610090, https://doi.org/10.1002/lapl.200610090

Vancouver

Manshina A, Povolotskiy A, Ivanova T, Kurochkin A, Tver'yanovich Y, Kim D и пр. Laser-assisted metal deposition from CuSO4-based electrolyte solution. Laser Physics Letters. 2007 Февр.;4(2):163-167. https://doi.org/10.1002/lapl.200610090, https://doi.org/10.1002/lapl.200610090

Author

Manshina, A. ; Povolotskiy, A. ; Ivanova, T. ; Kurochkin, A. ; Tver'yanovich, Yu ; Kim, D. ; Kim, M. ; Kwon, S. C. / Laser-assisted metal deposition from CuSO4-based electrolyte solution. в: Laser Physics Letters. 2007 ; Том 4, № 2. стр. 163-167.

BibTeX

@article{e49c0a02460041d29df054011e21404b,
title = "Laser-assisted metal deposition from CuSO4-based electrolyte solution",
abstract = "The copper spots were precipitated on the SiO2 substrates with Laser-induced Chemical Liquid phase Deposition (LCLD) method. The focused beam of the CW Ar+ laser generated in the multiwave regime was used for the metal precipitation. The deposition process was initiated by a laser-assisted photothermal chemical reaction, which results in the reduction of the metal complexes to the metal. To minimize the negative influence of the bubbles formation phenomenon the {"}substrate-side{"} geometry of the metal deposition has been suggested. The dependence of the metal precipitation process on the laser power and the deposition time was studied. Laser power 240 mW was found to be the threshold value for the metal deposition from the CUSO4-based electrolyte solution at the temperature 298 K. A figure is presented. The microphoto of metal spots deposited at different laser powers (240-400 mW).",
keywords = "Cu deposition, Electrolyte solution, Laser-induced electrolyte plating, Liquid-phase precursor",
author = "A. Manshina and A. Povolotskiy and T. Ivanova and A. Kurochkin and Yu Tver'yanovich and D. Kim and M. Kim and Kwon, {S. C.}",
year = "2007",
month = feb,
doi = "10.1002/lapl.200610090",
language = "English",
volume = "4",
pages = "163--167",
journal = "Laser Physics Letters",
issn = "1612-2011",
publisher = "IOP Publishing Ltd.",
number = "2",

}

RIS

TY - JOUR

T1 - Laser-assisted metal deposition from CuSO4-based electrolyte solution

AU - Manshina, A.

AU - Povolotskiy, A.

AU - Ivanova, T.

AU - Kurochkin, A.

AU - Tver'yanovich, Yu

AU - Kim, D.

AU - Kim, M.

AU - Kwon, S. C.

PY - 2007/2

Y1 - 2007/2

N2 - The copper spots were precipitated on the SiO2 substrates with Laser-induced Chemical Liquid phase Deposition (LCLD) method. The focused beam of the CW Ar+ laser generated in the multiwave regime was used for the metal precipitation. The deposition process was initiated by a laser-assisted photothermal chemical reaction, which results in the reduction of the metal complexes to the metal. To minimize the negative influence of the bubbles formation phenomenon the "substrate-side" geometry of the metal deposition has been suggested. The dependence of the metal precipitation process on the laser power and the deposition time was studied. Laser power 240 mW was found to be the threshold value for the metal deposition from the CUSO4-based electrolyte solution at the temperature 298 K. A figure is presented. The microphoto of metal spots deposited at different laser powers (240-400 mW).

AB - The copper spots were precipitated on the SiO2 substrates with Laser-induced Chemical Liquid phase Deposition (LCLD) method. The focused beam of the CW Ar+ laser generated in the multiwave regime was used for the metal precipitation. The deposition process was initiated by a laser-assisted photothermal chemical reaction, which results in the reduction of the metal complexes to the metal. To minimize the negative influence of the bubbles formation phenomenon the "substrate-side" geometry of the metal deposition has been suggested. The dependence of the metal precipitation process on the laser power and the deposition time was studied. Laser power 240 mW was found to be the threshold value for the metal deposition from the CUSO4-based electrolyte solution at the temperature 298 K. A figure is presented. The microphoto of metal spots deposited at different laser powers (240-400 mW).

KW - Cu deposition

KW - Electrolyte solution

KW - Laser-induced electrolyte plating

KW - Liquid-phase precursor

UR - http://www.scopus.com/inward/record.url?scp=34547351223&partnerID=8YFLogxK

U2 - 10.1002/lapl.200610090

DO - 10.1002/lapl.200610090

M3 - Article

VL - 4

SP - 163

EP - 167

JO - Laser Physics Letters

JF - Laser Physics Letters

SN - 1612-2011

IS - 2

ER -

ID: 5100181