Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
Interaction of edge dislocation array with bimaterial interface incorporating interface elasticity. / Grekov, M; Sergeeva, T. S.
в: International Journal of Engineering Science, Том 149, 103233, 04.2020.Результаты исследований: Научные публикации в периодических изданиях › статья › Рецензирование
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TY - JOUR
T1 - Interaction of edge dislocation array with bimaterial interface incorporating interface elasticity
AU - Grekov, M
AU - Sergeeva, T. S.
PY - 2020/4
Y1 - 2020/4
N2 - We extend the analytical method developed earlier for constructing periodic Green functions in the case of a half plane with surface stress to the problem on an interaction between the dislocation array (misfit dislocations) and the interface in bimaterial at the nanoscale. We use the complete Gurtin–Murdoch surface elasticity model for the interface under plane strain conditions, incorporating the interface stress and interface tension. Based on Goursat–Kolosov's complex potentials, Muskhelishvili's representations and original superposition technique, we reduce the solution of the problem to the singular integro-differential equation in complex displacement at the interface and derive analytical formulas for the elastic field in the explicit form suitable for numerical investigations. Numerical results are obtained by neglecting residual interface stress (interface tension) in order to reveal the pure effect of interface properties due to deformation. Bearing in mind that strength and fracture of heterogeneous and crystalline materials is essentially influenced by the stress field at the interface and the dislocation mobility, we give the numerical results of analyzing the stress distribution at the interface and image forces acting on dislocations at the nanoscale depending on the dislocation-interface distance, period of the array and stiffness ratio of the bimaterial.
AB - We extend the analytical method developed earlier for constructing periodic Green functions in the case of a half plane with surface stress to the problem on an interaction between the dislocation array (misfit dislocations) and the interface in bimaterial at the nanoscale. We use the complete Gurtin–Murdoch surface elasticity model for the interface under plane strain conditions, incorporating the interface stress and interface tension. Based on Goursat–Kolosov's complex potentials, Muskhelishvili's representations and original superposition technique, we reduce the solution of the problem to the singular integro-differential equation in complex displacement at the interface and derive analytical formulas for the elastic field in the explicit form suitable for numerical investigations. Numerical results are obtained by neglecting residual interface stress (interface tension) in order to reveal the pure effect of interface properties due to deformation. Bearing in mind that strength and fracture of heterogeneous and crystalline materials is essentially influenced by the stress field at the interface and the dislocation mobility, we give the numerical results of analyzing the stress distribution at the interface and image forces acting on dislocations at the nanoscale depending on the dislocation-interface distance, period of the array and stiffness ratio of the bimaterial.
KW - Bimaterial
KW - Edge dislocation array
KW - Elastic field
KW - Image forces
KW - Interface elasticity
KW - Superposition technique
KW - FIELDS
KW - ENERGY
KW - SIZE-DEPENDENT INTERACTION
KW - NANO-INHOMOGENEITIES
KW - BEHAVIOR
KW - SURFACE ELASTICITY
KW - MECHANICS
KW - INCLUSION
KW - STRESS
KW - EMISSION
UR - http://www.scopus.com/inward/record.url?scp=85079347046&partnerID=8YFLogxK
UR - https://proxy.library.spbu.ru:3693/item.asp?id=43246703
UR - https://www.mendeley.com/catalogue/649405ed-e479-35d1-b70f-0ab5ca6dcf1c/
U2 - 10.1016/j.ijengsci.2020.103233
DO - 10.1016/j.ijengsci.2020.103233
M3 - Article
AN - SCOPUS:85079347046
VL - 149
JO - International Journal of Engineering Science
JF - International Journal of Engineering Science
SN - 0020-7225
M1 - 103233
ER -
ID: 51822072