Si-based light emitters with efficient emission at 1.5 or 1.3 μm are required for on-chip optical interconnection for the ultra large scale integrated circuits in the future. In this paper, we have shown that dislocation networks in Si formed by direct wafer bonding emit a quartet of luminescence D-lines. The D-line spectrum can be tailored by the structure of the dislocation network. The D1 or D3, with a wavelength of 1.5 or 1.3 μm respectively, can be made dominating in the luminescence spectrum. An external bias voltage applied to the bonded interface can significantly enhance the luminescence intensity of D-lines.