Standard

Enhanced mechanical properties and electrical conductivity in ultra-fine grained Al alloy processed via ECAP-PC. / Murashkin, M.; Sabirov, I.; Kazykhanov, V.; Bobruk, E.; Dubravina, A.; Valiev, R.Z.

2013.

Результаты исследований: Иные виды публикацийинаянаучная

Harvard

APA

Vancouver

Author

BibTeX

@misc{5895432c278e48218fe79f237b571658,
title = "Enhanced mechanical properties and electrical conductivity in ultra-fine grained Al alloy processed via ECAP-PC",
abstract = "The objective of this work is to study the effect of grain refinement using equal channel angular pressing with parallel channels (ECAP-PC) on microstructure, mechanical properties, and electrical conductivity of an Al–Mg–Si alloy. The coarse grained (CG) material is subjected to ECAP-PC processing at 100 C for 1, 2, and 6 passes. Mechanical behavior of the Al–Mg–Si alloy after ECAP-PC processing and its electrical conductivity are analyzed with respect to the microstructure developed during ECAP-PC processing. The effect of artificial aging (AA) on the microstructure, mechanical properties, and electrical conductivity of the ECAP-PC processed Al–Mg– Si alloy is investigated. It is shown that the microstructure developed during ECAP-PC processing affects the kinetics of the aging process that, in turn, affects the mechanical properties and electrical conductivity of the material. It is demonstrated that both mechanical properties and electrical conductivity of the Al–Mg–Si alloy can be simultaneously enhanced v",
author = "M. Murashkin and I. Sabirov and V. Kazykhanov and E. Bobruk and A. Dubravina and R.Z. Valiev",
year = "2013",
doi = "DOI 10.1007/s10853-013-7279-8",
language = "English",
type = "Other",

}

RIS

TY - GEN

T1 - Enhanced mechanical properties and electrical conductivity in ultra-fine grained Al alloy processed via ECAP-PC

AU - Murashkin, M.

AU - Sabirov, I.

AU - Kazykhanov, V.

AU - Bobruk, E.

AU - Dubravina, A.

AU - Valiev, R.Z.

PY - 2013

Y1 - 2013

N2 - The objective of this work is to study the effect of grain refinement using equal channel angular pressing with parallel channels (ECAP-PC) on microstructure, mechanical properties, and electrical conductivity of an Al–Mg–Si alloy. The coarse grained (CG) material is subjected to ECAP-PC processing at 100 C for 1, 2, and 6 passes. Mechanical behavior of the Al–Mg–Si alloy after ECAP-PC processing and its electrical conductivity are analyzed with respect to the microstructure developed during ECAP-PC processing. The effect of artificial aging (AA) on the microstructure, mechanical properties, and electrical conductivity of the ECAP-PC processed Al–Mg– Si alloy is investigated. It is shown that the microstructure developed during ECAP-PC processing affects the kinetics of the aging process that, in turn, affects the mechanical properties and electrical conductivity of the material. It is demonstrated that both mechanical properties and electrical conductivity of the Al–Mg–Si alloy can be simultaneously enhanced v

AB - The objective of this work is to study the effect of grain refinement using equal channel angular pressing with parallel channels (ECAP-PC) on microstructure, mechanical properties, and electrical conductivity of an Al–Mg–Si alloy. The coarse grained (CG) material is subjected to ECAP-PC processing at 100 C for 1, 2, and 6 passes. Mechanical behavior of the Al–Mg–Si alloy after ECAP-PC processing and its electrical conductivity are analyzed with respect to the microstructure developed during ECAP-PC processing. The effect of artificial aging (AA) on the microstructure, mechanical properties, and electrical conductivity of the ECAP-PC processed Al–Mg– Si alloy is investigated. It is shown that the microstructure developed during ECAP-PC processing affects the kinetics of the aging process that, in turn, affects the mechanical properties and electrical conductivity of the material. It is demonstrated that both mechanical properties and electrical conductivity of the Al–Mg–Si alloy can be simultaneously enhanced v

U2 - DOI 10.1007/s10853-013-7279-8

DO - DOI 10.1007/s10853-013-7279-8

M3 - Other contribution

ER -

ID: 5557805