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Electromigration and stress affected kinetics of IMC growth of binary Cu-Sn couple. / Shtegman, Vladislav; Morozov, Aleksandr; Freidin, Alexander; Müller, Wolfgang H.

в: AIP Conference Proceedings, Том 2371, № 1, 030007, 13.07.2021.

Результаты исследований: Научные публикации в периодических изданиях › статья в журнале по материалам конференции

Harvard

Shtegman, V, Morozov, A, Freidin, A & Müller, WH 2021, 'Electromigration and stress affected kinetics of IMC growth of binary Cu-Sn couple', AIP Conference Proceedings, Том. 2371, № 1, 030007. https://doi.org/10.1063/5.0059609

APA

Shtegman, V., Morozov, A., Freidin, A., & Müller, W. H. (2021). Electromigration and stress affected kinetics of IMC growth of binary Cu-Sn couple. AIP Conference Proceedings, 2371(1), [030007]. https://doi.org/10.1063/5.0059609

Vancouver

Shtegman V, Morozov A, Freidin A, Müller WH. Electromigration and stress affected kinetics of IMC growth of binary Cu-Sn couple. AIP Conference Proceedings. 2021 Июль 13;2371(1). 030007. https://doi.org/10.1063/5.0059609

Author

Shtegman, Vladislav ; Morozov, Aleksandr ; Freidin, Alexander ; Müller, Wolfgang H. / Electromigration and stress affected kinetics of IMC growth of binary Cu-Sn couple. в: AIP Conference Proceedings. 2021 ; Том 2371, № 1.

BibTeX

@article{aa2704b516f0439aabb6266d7f2c564b,
title = "Electromigration and stress affected kinetics of IMC growth of binary Cu-Sn couple",
abstract = "An analytical model of electromigration and stress affected kinetics of a chemical reaction is investigated based on the notion of the chemical affinity tensor within the small strain approximation. Effects of stresses are accounted for through their influence on the chemical affinity tensor on which the reaction front velocity depends. Electromigration is considered as an additional summand in the total flux of the diffusive constituents. The Mean-Time-To-Failure (MTTF) is estimated based on Black's equation. Then the critical thickness of the IMC layer is calculated and a dimensionless parameter, which characterizes the accumulation of vacancies due to electromigration enhanced diffusion is proposed.",
author = "Vladislav Shtegman and Aleksandr Morozov and Alexander Freidin and M{\"u}ller, {Wolfgang H.}",
note = "Funding Information: The authors appreciate the financial support from the joint project of the Russian Foundation for Basic Research (RFBR, 17-51-12055) and Deutsche Forschungsgemeinschaft (DFG, MU 1752/47-1). Publisher Copyright: {\textcopyright} 2021 Author(s).; 29th Russian Conference on Mathematical Modeling in Natural Sciences, RuMoNaS 2020 ; Conference date: 07-10-2020 Through 09-10-2020",
year = "2021",
month = jul,
day = "13",
doi = "10.1063/5.0059609",
language = "English",
volume = "2371",
journal = "AIP Conference Proceedings",
issn = "0094-243X",
publisher = "American Institute of Physics",
number = "1",

}

RIS

TY - JOUR

T1 - Electromigration and stress affected kinetics of IMC growth of binary Cu-Sn couple

AU - Shtegman, Vladislav

AU - Morozov, Aleksandr

AU - Freidin, Alexander

AU - Müller, Wolfgang H.

N1 - Funding Information: The authors appreciate the financial support from the joint project of the Russian Foundation for Basic Research (RFBR, 17-51-12055) and Deutsche Forschungsgemeinschaft (DFG, MU 1752/47-1). Publisher Copyright: © 2021 Author(s).

PY - 2021/7/13

Y1 - 2021/7/13

N2 - An analytical model of electromigration and stress affected kinetics of a chemical reaction is investigated based on the notion of the chemical affinity tensor within the small strain approximation. Effects of stresses are accounted for through their influence on the chemical affinity tensor on which the reaction front velocity depends. Electromigration is considered as an additional summand in the total flux of the diffusive constituents. The Mean-Time-To-Failure (MTTF) is estimated based on Black's equation. Then the critical thickness of the IMC layer is calculated and a dimensionless parameter, which characterizes the accumulation of vacancies due to electromigration enhanced diffusion is proposed.

AB - An analytical model of electromigration and stress affected kinetics of a chemical reaction is investigated based on the notion of the chemical affinity tensor within the small strain approximation. Effects of stresses are accounted for through their influence on the chemical affinity tensor on which the reaction front velocity depends. Electromigration is considered as an additional summand in the total flux of the diffusive constituents. The Mean-Time-To-Failure (MTTF) is estimated based on Black's equation. Then the critical thickness of the IMC layer is calculated and a dimensionless parameter, which characterizes the accumulation of vacancies due to electromigration enhanced diffusion is proposed.

UR - http://www.scopus.com/inward/record.url?scp=85111404339&partnerID=8YFLogxK

UR - https://www.researchgate.net/publication/353573515_Proceedings_of_29th_Russian_Conference_on_Mathematical_Modelling_in_Natural_Science_RuMoNaS_2020

U2 - 10.1063/5.0059609

DO - 10.1063/5.0059609

M3 - Conference article

AN - SCOPUS:85111404339

VL - 2371

JO - AIP Conference Proceedings

JF - AIP Conference Proceedings

SN - 0094-243X

IS - 1

M1 - 030007

T2 - 29th Russian Conference on Mathematical Modeling in Natural Sciences, RuMoNaS 2020

Y2 - 7 October 2020 through 9 October 2020

ER -

ID: 86643751