Research output: Contribution to journal › Article › peer-review
Temperature Dependence of Sessile Bubble Contact Angle at a Water–Silicon Interface. / Esipova, Natalya Evgenyevna; Rusanov, Anatoly Ivanovich; Sobolev, Vladimir Dmitrievich.
In: Colloid Journal, Vol. 82, No. 5, 01.09.2020, p. 522-528.Research output: Contribution to journal › Article › peer-review
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TY - JOUR
T1 - Temperature Dependence of Sessile Bubble Contact Angle at a Water–Silicon Interface
AU - Esipova, Natalya Evgenyevna
AU - Rusanov, Anatoly Ivanovich
AU - Sobolev, Vladimir Dmitrievich
N1 - Esipova, N.E., Rusanov, A.I. & Sobolev, V.D. Temperature Dependence of Sessile Bubble Contact Angle at a Water–Silicon Interface. Colloid J 82, 522–528 (2020). https://doi.org/10.1134/S1061933X20050063
PY - 2020/9/1
Y1 - 2020/9/1
N2 - The goal of this work is the experimental verification of a recently formulated thermodynamic theory of the temperature dependence of sessile bubble contact angle [Rusanov, A.I., Colloid J., 2020, vol. 82, p. 303]. In particular, the possibilities of an increase in small contact angles and a decrease in large ones (larger than 90°) are tested. The experiments are carried out with a bubble at a water–silicon interface using two types of polished silicon plates: clean plates with a water contact angle of 12° and plates with a hydrophobized surface and the water contact angle of 104° within a temperature range 20–80°C. In both cases, the experiments have confirmed the theory. In addition, a temperature pinning effect (anchoring of the three-phase contact line) has been revealed for the sessile bubble.
AB - The goal of this work is the experimental verification of a recently formulated thermodynamic theory of the temperature dependence of sessile bubble contact angle [Rusanov, A.I., Colloid J., 2020, vol. 82, p. 303]. In particular, the possibilities of an increase in small contact angles and a decrease in large ones (larger than 90°) are tested. The experiments are carried out with a bubble at a water–silicon interface using two types of polished silicon plates: clean plates with a water contact angle of 12° and plates with a hydrophobized surface and the water contact angle of 104° within a temperature range 20–80°C. In both cases, the experiments have confirmed the theory. In addition, a temperature pinning effect (anchoring of the three-phase contact line) has been revealed for the sessile bubble.
UR - https://link.springer.com/article/10.1134/S1061933X20050063
UR - http://www.scopus.com/inward/record.url?scp=85091705506&partnerID=8YFLogxK
U2 - 10.1134/S1061933X20050063
DO - 10.1134/S1061933X20050063
M3 - Article
VL - 82
SP - 522
EP - 528
JO - Colloid Journal
JF - Colloid Journal
SN - 1061-933X
IS - 5
ER -
ID: 61458481