It is a recognized fact that during film deposition and subsequent thermal processing the film surface evolves into an undulating profile. Surface roughness affects many important aspects in the engineering application of thin film materials such as wetting, heat transfer, mechanical, electromagnetic and optical properties. To accurately control the morphological surface modifications at the micro- and nanoscale and improve manufacturing techniques, we design a mathematical model of the surface self-organization process in multilayer film materials. In this paper, we consider a solid film coating with an arbitrary number of layers under plane strain conditions. The film surface has a small initial perturbation described by a periodic function. It is assumed that the evolution of the surface relief is governed by surface and volume diffusion. Based on Gibbs thermodynamics and linear theory of elasticity, we present a procedure for constructing a governing equation that gives the amplitude change of the surface perturbation with time. A parametric study of the evolution equation leads to the definition of a critical undulation wavelength that stabilizes the surface. As a numerical result, the influence of geometrical and physical parameters on the morphological stability of an isotropic two-layered film coating is analyzed.