Standard

One-step laser-assisted metallization of PDMS using deep eutectic solvent inks for flexible electronics. / Vavilov, A; Iukhtanov, N; Korikina, I; Gurbatov, S; Neustroev, I; Tumkin, I; Shishov, A; Makarov, S; Khairullina, E; Logunov, L.

In: Surfaces and Interfaces, Vol. 97, 110156, 01.09.2026.

Research output: Contribution to journal › Article › peer-review

Harvard

Vavilov, A, Iukhtanov, N, Korikina, I, Gurbatov, S, Neustroev, I, Tumkin, I, Shishov, A, Makarov, S, Khairullina, E & Logunov, L 2026, 'One-step laser-assisted metallization of PDMS using deep eutectic solvent inks for flexible electronics', Surfaces and Interfaces, vol. 97, 110156. https://doi.org/10.1016/j.surfin.2026.110156

APA

Vavilov, A., Iukhtanov, N., Korikina, I., Gurbatov, S., Neustroev, I., Tumkin, I., Shishov, A., Makarov, S., Khairullina, E., & Logunov, L. (2026). One-step laser-assisted metallization of PDMS using deep eutectic solvent inks for flexible electronics. Surfaces and Interfaces, 97, [110156]. https://doi.org/10.1016/j.surfin.2026.110156

Vancouver

Vavilov A, Iukhtanov N, Korikina I, Gurbatov S, Neustroev I, Tumkin I et al. One-step laser-assisted metallization of PDMS using deep eutectic solvent inks for flexible electronics. Surfaces and Interfaces. 2026 Sep 1;97. 110156. https://doi.org/10.1016/j.surfin.2026.110156

Author

Vavilov, A ; Iukhtanov, N ; Korikina, I ; Gurbatov, S ; Neustroev, I ; Tumkin, I ; Shishov, A ; Makarov, S ; Khairullina, E ; Logunov, L. / One-step laser-assisted metallization of PDMS using deep eutectic solvent inks for flexible electronics. In: Surfaces and Interfaces. 2026 ; Vol. 97.

BibTeX

@article{8a0d358bd56948b590fab1bf015e4eaa,
title = "One-step laser-assisted metallization of PDMS using deep eutectic solvent inks for flexible electronics",
abstract = "We report a one‑step direct laser writing (DLW) approach that metallizes polydimethylsiloxane (PDMS) with conductive copper patterns from deep eutectic solvent (DES) inks under ambient conditions, without compromising the inherent mechanical or optical properties of the substrate. The underlying patterning mechanism is confirmed by thermal modeling and experimental validation, with particular emphasis on the influence of substrate thermophysical properties and DES layer thickness on the metallization process. Under optimized conditions, copper patterns with resistivity as low as 2.25 × 10-³ Ω·cm can be fabricated while maintaining excellent mechanical durability under repeated bending deformation. Functional performance is demonstrated by integrating the deposited copper patterns into flexible heaters and LED circuits. These results establish DES-enabled direct laser writing as a scalable and environmentally friendly platform for fabrication of soft electronic devices.",
keywords = "Copper metallization, Direct laser writing deep eutectic solvent inks, Flexible electronics, Flexible microheaters, Polydimethylsiloxane",
author = "A Vavilov and N Iukhtanov and I Korikina and S Gurbatov and I Neustroev and I Tumkin and A Shishov and S Makarov and E Khairullina and L Logunov",
year = "2026",
month = sep,
day = "1",
doi = "10.1016/j.surfin.2026.110156",
language = "English",
volume = "97",
journal = "Surfaces and Interfaces",
issn = "2468-0230",
publisher = "Elsevier",

}

RIS

TY - JOUR

T1 - One-step laser-assisted metallization of PDMS using deep eutectic solvent inks for flexible electronics

AU - Vavilov, A

AU - Iukhtanov, N

AU - Korikina, I

AU - Gurbatov, S

AU - Neustroev, I

AU - Tumkin, I

AU - Shishov, A

AU - Makarov, S

AU - Khairullina, E

AU - Logunov, L

PY - 2026/9/1

Y1 - 2026/9/1

N2 - We report a one‑step direct laser writing (DLW) approach that metallizes polydimethylsiloxane (PDMS) with conductive copper patterns from deep eutectic solvent (DES) inks under ambient conditions, without compromising the inherent mechanical or optical properties of the substrate. The underlying patterning mechanism is confirmed by thermal modeling and experimental validation, with particular emphasis on the influence of substrate thermophysical properties and DES layer thickness on the metallization process. Under optimized conditions, copper patterns with resistivity as low as 2.25 × 10-³ Ω·cm can be fabricated while maintaining excellent mechanical durability under repeated bending deformation. Functional performance is demonstrated by integrating the deposited copper patterns into flexible heaters and LED circuits. These results establish DES-enabled direct laser writing as a scalable and environmentally friendly platform for fabrication of soft electronic devices.

AB - We report a one‑step direct laser writing (DLW) approach that metallizes polydimethylsiloxane (PDMS) with conductive copper patterns from deep eutectic solvent (DES) inks under ambient conditions, without compromising the inherent mechanical or optical properties of the substrate. The underlying patterning mechanism is confirmed by thermal modeling and experimental validation, with particular emphasis on the influence of substrate thermophysical properties and DES layer thickness on the metallization process. Under optimized conditions, copper patterns with resistivity as low as 2.25 × 10-³ Ω·cm can be fabricated while maintaining excellent mechanical durability under repeated bending deformation. Functional performance is demonstrated by integrating the deposited copper patterns into flexible heaters and LED circuits. These results establish DES-enabled direct laser writing as a scalable and environmentally friendly platform for fabrication of soft electronic devices.

KW - Copper metallization

KW - Direct laser writing deep eutectic solvent inks

KW - Flexible electronics

KW - Flexible microheaters

KW - Polydimethylsiloxane

UR - https://www.mendeley.com/catalogue/296d01fc-493f-351e-8412-703310e59b19/

U2 - 10.1016/j.surfin.2026.110156

DO - 10.1016/j.surfin.2026.110156

M3 - Article

VL - 97

JO - Surfaces and Interfaces

JF - Surfaces and Interfaces

SN - 2468-0230

M1 - 110156

ER -

ID: 159185252