Non-Polynomial Splines and Solving the Heat Equation

Standard

Non-Polynomial Splines and Solving the Heat Equation. / Burova, I. G.

Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. p. 140-146 9402599 (Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Harvard

Burova, IG 2020, Non-Polynomial Splines and Solving the Heat Equation. in Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020., 9402599, Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020, Institute of Electrical and Electronics Engineers Inc., pp. 140-146, 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020, Platanias, Chania, Crete Island, Greece, 19/07/20. https://doi.org/10.1109/CSCC49995.2020.00033

APA

Burova, I. G. (2020). Non-Polynomial Splines and Solving the Heat Equation. In Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020 (pp. 140-146). [9402599] (Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/CSCC49995.2020.00033

Vancouver

Burova IG. Non-Polynomial Splines and Solving the Heat Equation. In Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020. Institute of Electrical and Electronics Engineers Inc. 2020. p. 140-146. 9402599. (Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020). https://doi.org/10.1109/CSCC49995.2020.00033

Author

Burova, I. G. / Non-Polynomial Splines and Solving the Heat Equation. Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020. Institute of Electrical and Electronics Engineers Inc., 2020. pp. 140-146 (Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020).

BibTeX

@inproceedings{7ea21d0afd3e4133bc887f97c181a293,

title = "Non-Polynomial Splines and Solving the Heat Equation",

abstract = "This paper discusses the application of the polynomial, exponential and trigonometric splines of the fourth order of approximation to the construction of methods for numerically solving the heat conduction problem. The exponential splines and the trigonometric splines are used here to approximate the partial derivatives. This approach allows us to construct explicit and implicit difference schemes. The main focus of the paper is on implicit difference schemes. Numerical examples are given.",

keywords = "exponential splines, heat conduction problem, polynomial splines, trigonometric splines",

author = "Burova, {I. G.}",

note = "Publisher Copyright: {\textcopyright} 2020 IEEE. Copyright: Copyright 2021 Elsevier B.V., All rights reserved.; 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020 ; Conference date: 19-07-2020 Through 22-07-2020",

year = "2020",

month = jul,

doi = "10.1109/CSCC49995.2020.00033",

language = "English",

series = "Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "140--146",

booktitle = "Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020",

address = "United States",

}

RIS

TY - GEN

T1 - Non-Polynomial Splines and Solving the Heat Equation

AU - Burova, I. G.

PY - 2020/7

Y1 - 2020/7

N2 - This paper discusses the application of the polynomial, exponential and trigonometric splines of the fourth order of approximation to the construction of methods for numerically solving the heat conduction problem. The exponential splines and the trigonometric splines are used here to approximate the partial derivatives. This approach allows us to construct explicit and implicit difference schemes. The main focus of the paper is on implicit difference schemes. Numerical examples are given.

AB - This paper discusses the application of the polynomial, exponential and trigonometric splines of the fourth order of approximation to the construction of methods for numerically solving the heat conduction problem. The exponential splines and the trigonometric splines are used here to approximate the partial derivatives. This approach allows us to construct explicit and implicit difference schemes. The main focus of the paper is on implicit difference schemes. Numerical examples are given.

KW - exponential splines

KW - heat conduction problem

KW - polynomial splines

KW - trigonometric splines

UR - http://www.scopus.com/inward/record.url?scp=85105326308&partnerID=8YFLogxK

U2 - 10.1109/CSCC49995.2020.00033

DO - 10.1109/CSCC49995.2020.00033

M3 - Conference contribution

AN - SCOPUS:85105326308

T3 - Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020

SP - 140

EP - 146

BT - Proceedings - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 24th International Conference on Circuits, Systems, Communications and Computers, CSCC 2020

Y2 - 19 July 2020 through 22 July 2020

ER -

ID: 76977262