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Laser-induced deposition of copper from deep eutectic solvents : Optimization of chemical and physical parameters. / Shishov, Andrey; Gordeychuk, Dmitry; Logunov, Lev; Levshakova, Aleksandra; Andrusenko, Elena; Chernyshov, Ivan; Danilova, Elena; Panov, Maxim; Khairullina, Evgeniia; Tumkin, Ilya.

In: New Journal of Chemistry, Vol. 45, No. 46, 14.12.2021, p. 21896-21904.

Research output: Contribution to journal › Article › peer-review

Harvard

Shishov, A, Gordeychuk, D, Logunov, L, Levshakova, A, Andrusenko, E, Chernyshov, I, Danilova, E, Panov, M, Khairullina, E & Tumkin, I 2021, 'Laser-induced deposition of copper from deep eutectic solvents: Optimization of chemical and physical parameters', New Journal of Chemistry, vol. 45, no. 46, pp. 21896-21904. https://doi.org/10.1039/d1nj04158d

APA

Shishov, A., Gordeychuk, D., Logunov, L., Levshakova, A., Andrusenko, E., Chernyshov, I., Danilova, E., Panov, M., Khairullina, E., & Tumkin, I. (2021). Laser-induced deposition of copper from deep eutectic solvents: Optimization of chemical and physical parameters. New Journal of Chemistry, 45(46), 21896-21904. https://doi.org/10.1039/d1nj04158d

Vancouver

Shishov A, Gordeychuk D, Logunov L, Levshakova A, Andrusenko E, Chernyshov I et al. Laser-induced deposition of copper from deep eutectic solvents: Optimization of chemical and physical parameters. New Journal of Chemistry. 2021 Dec 14;45(46):21896-21904. https://doi.org/10.1039/d1nj04158d

Author

Shishov, Andrey ; Gordeychuk, Dmitry ; Logunov, Lev ; Levshakova, Aleksandra ; Andrusenko, Elena ; Chernyshov, Ivan ; Danilova, Elena ; Panov, Maxim ; Khairullina, Evgeniia ; Tumkin, Ilya. / Laser-induced deposition of copper from deep eutectic solvents : Optimization of chemical and physical parameters. In: New Journal of Chemistry. 2021 ; Vol. 45, No. 46. pp. 21896-21904.

BibTeX

@article{6dda4b48609a4efe9dd5f521f77586a6,
title = "Laser-induced deposition of copper from deep eutectic solvents: Optimization of chemical and physical parameters",
abstract = "Fabrication of the conductive copper structures on the surface of various dielectric materials is quite important in many fields of science. There are a lot of chemical and physical methods and approaches that can be used for this purpose. Recently, we demonstrated the possibility of performing laser-assisted deposition of copper using deep eutectic solvents (DESs). The use of DESs instead of aqueous solutions allowed increasing the deposition rate by more than 100 times. In this work, for the first time, the influence of different chemical parameters, such as nature of deep eutectic solvent and concentration of copper, as well as physical parameters, including the intensity of laser radiation and the scanning speed, on the process of copper deposition was investigated. We experimentally showed and confirmed theoretically that the use of citric and tartaric acids such as DES components provides conditions for the formation of copper micropatterns with predefined characteristics.",
author = "Andrey Shishov and Dmitry Gordeychuk and Lev Logunov and Aleksandra Levshakova and Elena Andrusenko and Ivan Chernyshov and Elena Danilova and Maxim Panov and Evgeniia Khairullina and Ilya Tumkin",
note = "Publisher Copyright: {\textcopyright} The Royal Society of Chemistry and the Centre National de la Recherche Scientifique.",
year = "2021",
month = dec,
day = "14",
doi = "10.1039/d1nj04158d",
language = "English",
volume = "45",
pages = "21896--21904",
journal = "New Journal of Chemistry",
issn = "1144-0546",
publisher = "Royal Society of Chemistry",
number = "46",

}

RIS

TY - JOUR

T1 - Laser-induced deposition of copper from deep eutectic solvents

T2 - Optimization of chemical and physical parameters

AU - Shishov, Andrey

AU - Gordeychuk, Dmitry

AU - Logunov, Lev

AU - Levshakova, Aleksandra

AU - Andrusenko, Elena

AU - Chernyshov, Ivan

AU - Danilova, Elena

AU - Panov, Maxim

AU - Khairullina, Evgeniia

AU - Tumkin, Ilya

N1 - Publisher Copyright: © The Royal Society of Chemistry and the Centre National de la Recherche Scientifique.

PY - 2021/12/14

Y1 - 2021/12/14

N2 - Fabrication of the conductive copper structures on the surface of various dielectric materials is quite important in many fields of science. There are a lot of chemical and physical methods and approaches that can be used for this purpose. Recently, we demonstrated the possibility of performing laser-assisted deposition of copper using deep eutectic solvents (DESs). The use of DESs instead of aqueous solutions allowed increasing the deposition rate by more than 100 times. In this work, for the first time, the influence of different chemical parameters, such as nature of deep eutectic solvent and concentration of copper, as well as physical parameters, including the intensity of laser radiation and the scanning speed, on the process of copper deposition was investigated. We experimentally showed and confirmed theoretically that the use of citric and tartaric acids such as DES components provides conditions for the formation of copper micropatterns with predefined characteristics.

AB - Fabrication of the conductive copper structures on the surface of various dielectric materials is quite important in many fields of science. There are a lot of chemical and physical methods and approaches that can be used for this purpose. Recently, we demonstrated the possibility of performing laser-assisted deposition of copper using deep eutectic solvents (DESs). The use of DESs instead of aqueous solutions allowed increasing the deposition rate by more than 100 times. In this work, for the first time, the influence of different chemical parameters, such as nature of deep eutectic solvent and concentration of copper, as well as physical parameters, including the intensity of laser radiation and the scanning speed, on the process of copper deposition was investigated. We experimentally showed and confirmed theoretically that the use of citric and tartaric acids such as DES components provides conditions for the formation of copper micropatterns with predefined characteristics.

UR - http://www.scopus.com/inward/record.url?scp=85120738038&partnerID=8YFLogxK

U2 - 10.1039/d1nj04158d

DO - 10.1039/d1nj04158d

M3 - Article

AN - SCOPUS:85120738038

VL - 45

SP - 21896

EP - 21904

JO - New Journal of Chemistry

JF - New Journal of Chemistry

SN - 1144-0546

IS - 46

ER -

ID: 89093748