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Direct Laser Metallization from Deep Eutectic Solvents on Polymer Substrates. / Shmalko, A.; Zakharov, A.; Khairullina, E.; Tumkin, I.; Shestakov, D.; Komlev, A.; Danilovskiy, E.; Manshina, A.; Logunov, L.

In: Bulletin of the Russian Academy of Sciences: Physics, Vol. 88, No. Suppl 3, 20.01.2025, p. S385-S389.

Research output: Contribution to journal › Article › peer-review

Harvard

Shmalko, A, Zakharov, A, Khairullina, E, Tumkin, I, Shestakov, D, Komlev, A, Danilovskiy, E, Manshina, A & Logunov, L 2025, 'Direct Laser Metallization from Deep Eutectic Solvents on Polymer Substrates', Bulletin of the Russian Academy of Sciences: Physics, vol. 88, no. Suppl 3, pp. S385-S389. https://doi.org/10.1134/s1062873824709887

APA

Shmalko, A., Zakharov, A., Khairullina, E., Tumkin, I., Shestakov, D., Komlev, A., Danilovskiy, E., Manshina, A., & Logunov, L. (2025). Direct Laser Metallization from Deep Eutectic Solvents on Polymer Substrates. Bulletin of the Russian Academy of Sciences: Physics, 88(Suppl 3), S385-S389. https://doi.org/10.1134/s1062873824709887

Vancouver

Shmalko A, Zakharov A, Khairullina E, Tumkin I, Shestakov D, Komlev A et al. Direct Laser Metallization from Deep Eutectic Solvents on Polymer Substrates. Bulletin of the Russian Academy of Sciences: Physics. 2025 Jan 20;88(Suppl 3):S385-S389. https://doi.org/10.1134/s1062873824709887

Author

Shmalko, A. ; Zakharov, A. ; Khairullina, E. ; Tumkin, I. ; Shestakov, D. ; Komlev, A. ; Danilovskiy, E. ; Manshina, A. ; Logunov, L. / Direct Laser Metallization from Deep Eutectic Solvents on Polymer Substrates. In: Bulletin of the Russian Academy of Sciences: Physics. 2025 ; Vol. 88, No. Suppl 3. pp. S385-S389.

BibTeX

@article{88b7d4ff14ae4751826a5e1df2f7eaa3,
title = "Direct Laser Metallization from Deep Eutectic Solvents on Polymer Substrates",
abstract = "Abstract: The task of local metallization of polymer substrates such as PDMS (polydimethylsiloxane) is a challenging and important task for the development of biocompatible flexible electronics. Here we present for the first time the possibility of using the Direct laser metallization (DLM) method for fabrication of copper conducting structures on PDMS. It has been shown that DLM method allows one to obtain conductive structures with low resistivity and a developed surface with minimal thermal impact on the substrate. By optimizing the scanning speed and laser power density, it was possible to minimize the thermal degradation of PDMS and ensure reliable metal adhesion. The DLM method opens up new opportunities for creating flexible electronics, providing precise and cost-effective deposition of copper conductors on flexible substrates.",
keywords = "DES, DLM, LCLD, PDMS, copper conductive structures, flexible electronics, laser metallization, spin coating",
author = "A. Shmalko and A. Zakharov and E. Khairullina and I. Tumkin and D. Shestakov and A. Komlev and E. Danilovskiy and A. Manshina and L. Logunov",
year = "2025",
month = jan,
day = "20",
doi = "10.1134/s1062873824709887",
language = "English",
volume = "88",
pages = "S385--S389",
journal = "Bulletin of the Russian Academy of Sciences: Physics",
issn = "1062-8738",
publisher = "Allerton Press, Inc.",
number = "Suppl 3",

}

RIS

TY - JOUR

T1 - Direct Laser Metallization from Deep Eutectic Solvents on Polymer Substrates

AU - Shmalko, A.

AU - Zakharov, A.

AU - Khairullina, E.

AU - Tumkin, I.

AU - Shestakov, D.

AU - Komlev, A.

AU - Danilovskiy, E.

AU - Manshina, A.

AU - Logunov, L.

PY - 2025/1/20

Y1 - 2025/1/20

N2 - Abstract: The task of local metallization of polymer substrates such as PDMS (polydimethylsiloxane) is a challenging and important task for the development of biocompatible flexible electronics. Here we present for the first time the possibility of using the Direct laser metallization (DLM) method for fabrication of copper conducting structures on PDMS. It has been shown that DLM method allows one to obtain conductive structures with low resistivity and a developed surface with minimal thermal impact on the substrate. By optimizing the scanning speed and laser power density, it was possible to minimize the thermal degradation of PDMS and ensure reliable metal adhesion. The DLM method opens up new opportunities for creating flexible electronics, providing precise and cost-effective deposition of copper conductors on flexible substrates.

AB - Abstract: The task of local metallization of polymer substrates such as PDMS (polydimethylsiloxane) is a challenging and important task for the development of biocompatible flexible electronics. Here we present for the first time the possibility of using the Direct laser metallization (DLM) method for fabrication of copper conducting structures on PDMS. It has been shown that DLM method allows one to obtain conductive structures with low resistivity and a developed surface with minimal thermal impact on the substrate. By optimizing the scanning speed and laser power density, it was possible to minimize the thermal degradation of PDMS and ensure reliable metal adhesion. The DLM method opens up new opportunities for creating flexible electronics, providing precise and cost-effective deposition of copper conductors on flexible substrates.

KW - DES

KW - DLM

KW - LCLD

KW - PDMS

KW - copper conductive structures

KW - flexible electronics

KW - laser metallization

KW - spin coating

UR - https://www.mendeley.com/catalogue/eba2db35-ad23-334d-8085-971a6b55cc99/

U2 - 10.1134/s1062873824709887

DO - 10.1134/s1062873824709887

M3 - Article

VL - 88

SP - S385-S389

JO - Bulletin of the Russian Academy of Sciences: Physics

JF - Bulletin of the Russian Academy of Sciences: Physics

SN - 1062-8738

IS - Suppl 3

ER -

ID: 132509714