1. 2020
  2. Experimental and Theoretical Studies of Cu-Sn Intermetallic Phase Growth During High-Temperature Storage of Eutectic SnAg Interconnects

    Morozov, A., Freidin, A. B., Klinkov, V. A., Semencha, A. V., Müller, W. H. & Hauck, T., Dec 2020, In: Journal of Electronic Materials. 49, 12, p. 7194-7210 17 p.

    Research output: Contribution to journalArticlepeer-review

ID: 13761808