High rate laser deposition of conductive copper microstructures from deep eutectic solvents

Andrey Shishov, Dmitry Gordeychuk, Lev Logunov, Ilya Tumkin

Результат исследований: Научные публикации в периодических изданияхстатья

1 цитирование (Scopus)

Выдержка

In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.

Язык оригиналаанглийский
Страницы (с-по)9626-9628
Число страниц3
ЖурналChemical Communications
Том55
Номер выпуска65
DOI
СостояниеОпубликовано - 1 янв 2019

Отпечаток

Eutectics
Copper
Chemical lasers
Microstructure
Lasers
Deposition rates
Metals
Communication
Substrates

Предметные области Scopus

  • Катализ
  • Электроника, оптика и магнитные материалы
  • Керамика и композитные материалы
  • Химия (все)
  • Поверхности, слои и пленки
  • Металлы и сплавы
  • Химия материалов

Цитировать

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High rate laser deposition of conductive copper microstructures from deep eutectic solvents. / Shishov, Andrey; Gordeychuk, Dmitry; Logunov, Lev; Tumkin, Ilya.

В: Chemical Communications, Том 55, № 65, 01.01.2019, стр. 9626-9628.

Результат исследований: Научные публикации в периодических изданияхстатья

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AB - In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.

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