High rate laser deposition of conductive copper microstructures from deep eutectic solvents

Andrey Shishov, Dmitry Gordeychuk, Lev Logunov, Ilya Tumkin

Research output

Abstract

In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.

Original languageEnglish
Pages (from-to)9626-9628
Number of pages3
JournalChemical Communications
Volume55
Issue number65
DOIs
Publication statusPublished - 1 Jan 2019

Fingerprint

Eutectics
Copper
Chemical lasers
Microstructure
Lasers
Deposition rates
Metals
Communication
Substrates

Scopus subject areas

  • Catalysis
  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Chemistry(all)
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this

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abstract = "In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.",
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High rate laser deposition of conductive copper microstructures from deep eutectic solvents. / Shishov, Andrey; Gordeychuk, Dmitry; Logunov, Lev; Tumkin, Ilya.

In: Chemical Communications, Vol. 55, No. 65, 01.01.2019, p. 9626-9628.

Research output

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AU - Logunov, Lev

AU - Tumkin, Ilya

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AB - In this communication, the phenomenon of the laser chemical deposition of copper using deep eutectic solvents (DESs) on a dielectric substrate has been shown for the first time. The use of eutectic solvents made it possible to greatly simplify the procedure of metal deposition and increase the deposition rate by more than 150 times compared to the use of aqueous solutions.

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